The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2021

Filed:

Oct. 15, 2018
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Hardik Bhupendra Modi, Irvine, CA (US);

Adarsh Karan Jaiswal, Santa Ana, CA (US);

Anil K. Agarwal, Ladera Ranch, CA (US);

Engin Ibrahim Pehlivanoglu, Costa Mesa, CA (US);

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/311 (2013.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); G01S 19/21 (2010.01); H03F 3/195 (2006.01); H03H 9/02 (2006.01); H03H 9/64 (2006.01);
U.S. Cl.
CPC ...
H01L 41/311 (2013.01); G01S 19/21 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H03F 3/195 (2013.01); H03H 9/02976 (2013.01); H03H 9/6406 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6644 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06537 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01); H03F 2200/294 (2013.01);
Abstract

Stack assembly having electro-acoustic device. In some embodiments, a radio-frequency (RF) module can include a packaging substrate configured to receive a plurality of components, and an electro-acoustic device mounted on the packaging substrate. The RF module can further include a die having an integrated circuit and mounted over the electro-acoustic device to form a stack assembly. The electro-acoustic device can be, for example, a filter device such as a surface acoustic wave filter. The die can be, for example an amplifier die such as a low-noise amplifier implemented on a silicon die.


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