The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2021

Filed:

Jul. 31, 2018
Applicant:

Osram Oled Gmbh, Regensburg, DE;

Inventors:

Daniel Leisen, Regensburg, DE;

Herbert Brunner, Sinzing, DE;

Emilia Dinu, Regensburg, DE;

Jens Eberhard, Lemgo, DE;

Christina Keith, Neutraubling, DE;

Markus Pindl, Tegernheim, DE;

Thomas Reeswinkel, Regensburg, DE;

Daniel Richter, Bad Abbach, DE;

Christopher Wiesmann, Barbing, DE;

Ludwig Peyker, Regensburg, DE;

Alexander Linkov, Herzogenrath, DE;

Assignee:

OSRAM OLED GmbH, Regensburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/54 (2010.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01); H01L 31/0203 (2014.01); H01L 31/18 (2006.01); H01L 31/0232 (2014.01);
U.S. Cl.
CPC ...
H01L 33/54 (2013.01); H01L 31/0203 (2013.01); H01L 31/02322 (2013.01); H01L 31/18 (2013.01); H01L 33/502 (2013.01); H01L 33/56 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0091 (2013.01);
Abstract

A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.


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