The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2021
Filed:
Oct. 14, 2019
Applicant:
Lextar Electronics Corporation, Hsinchu, TW;
Inventors:
Te-Chung Wang, Hsinchu, TW;
Shiou-Yi Kuo, Hsinchu, TW;
Assignee:
Lextar Electronics Corporation, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/56 (2010.01); H01L 27/15 (2006.01); H01L 33/48 (2010.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01); H01L 33/52 (2010.01); H01L 29/06 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 21/0228 (2013.01); H01L 29/0665 (2013.01); H01L 33/52 (2013.01); H01L 2924/12041 (2013.01);
Abstract
A light emitting diode (LED) package includes a substrate, at least one micro LED chip, a black material layer, and a transparent material layer. The substrate has a width ranging from 100 micrometers to 1000 micrometers. The at least one micro LED chip is electrically mounted on a top surface of the substrate and has a width ranging from 1 micrometer to 100 micrometers. The black material layer covers the top surface of the substrate to expose the at least one micro LED chip. The transparent material layer covers the at least one micro LED chip and the black material layer.