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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11038086 B1

PDFFull Text
Date of Patent:
Jun. 15, 2021

Filed:

Mar. 07, 2017

Semiconductor light-emitting element and manufacturing method therefor

Applicant:

Semicon Light Co., Ltd., Gyeonggi-do, KR;

Inventors:

Soo Kun Jeon, Gyeonggi-do, KR;

Kyoung Min Kim, Gyeonggi-do, KR;

Eun Hyun Park, Gyeonggi-do, KR;

Young Kwan Cho, Gyeonggi-do, KR;

Gye Oul Jeong, Gyeonggi-do, KR;

Dong So Jung, Gyeonggi-do, KR;

Seung Ho Baek, Gyeonggi-do, KR;

Eung Suk Park, Gyeonggi-do, KR;

Hye Ji Rhee, Gyeonggi-do, KR;

Assignee:

SEMICON LIGHT CO., LTD., Gyeonggi-do, KR;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Feifei Yeung Lopez

Int. Cl.
CPC ...
H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 33/60 (2010.01); H01L 33/58 (2010.01); H01L 23/367 (2006.01); H01L 33/52 (2010.01); H01L 33/10 (2010.01); H01L 33/36 (2010.01); H01L 33/54 (2010.01); H01L 21/56 (2006.01); H01L 25/075 (2006.01); H01L 33/38 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 33/483 (2013.01); H01L 23/3675 (2013.01); H01L 33/10 (2013.01); H01L 33/36 (2013.01); H01L 33/486 (2013.01); H01L 33/52 (2013.01); H01L 33/54 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 21/568 (2013.01); H01L 25/0753 (2013.01); H01L 33/38 (2013.01); H01L 33/502 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/19 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01);
Abstract

Disclosed is a semiconductor light emitting device including: a body with a bottom part having at least one hole formed therein; a semiconductor light emitting device chip to be placed in each of the at least one hole, with the semiconductor light emitting device chip being comprised of a plurality of semiconductor layers including an active layer for generating light by electron-hole recombination, and an electrode electrically connected to the plurality of semiconductor layers; and an encapsulating member for covering the semiconductor light emitting device chip, wherein a hole—defining inner face of the bottom part has a plurality of angles of inclination.

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