The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2021

Filed:

Feb. 01, 2017
Applicant:

Utica Leaseco, Llc, Rochester Hills, MI (US);

Inventors:

Yan Zhu, Dublin, CA (US);

Sean Sweetnam, Menlo Park, CA (US);

Brendan M. Kayes, Los Gatos, CA (US);

Melissa J. Archer, San Jose, CA (US);

Gang He, Cupertino, CA (US);

Assignee:

UTICA LEASECO, LLC, Rochester Hills, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 31/0216 (2014.01); H01L 33/22 (2010.01); H01L 33/30 (2010.01); H01L 33/42 (2010.01); H01L 33/44 (2010.01); H01L 33/46 (2010.01); H01L 31/18 (2006.01); H01L 31/056 (2014.01); H01L 31/0236 (2006.01);
U.S. Cl.
CPC ...
H01L 33/0093 (2020.05); H01L 31/02168 (2013.01); H01L 31/02366 (2013.01); H01L 31/056 (2014.12); H01L 31/1892 (2013.01); H01L 33/0062 (2013.01); H01L 33/22 (2013.01); H01L 33/30 (2013.01); H01L 33/42 (2013.01); H01L 33/44 (2013.01); H01L 33/46 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0091 (2013.01); Y02E 10/52 (2013.01);
Abstract

An optoelectronic device having a textured layer is described. In an aspect, a method may be used to produce the optoelectronic device, where the method includes epitaxially growing a semiconductor layer of the optoelectronic device on a growth substrate, and exposing the semiconductor layer to an etching process to create at least one textured surface in the semiconductor layer. The textured semiconductor layer can be referred to as a textured layer. The etching process is performed without the use of a template layer, or similar layer, configured as a mask to generate the texturing. The etching process can be done by one or more of a liquid or solution-based chemical etchant, gas etching, laser etching, plasma etching, or ion etching. The method can also include lifting the semiconductor layer of the optoelectronic device from the growth substrate by, for example, the use of an epitaxial lift off (ELO) process.


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