The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2021

Filed:

Mar. 19, 2018
Applicant:

Sharp Kabushiki Kaisha, Sakai, JP;

Inventors:

Teruyuki Ueda, Sakai, JP;

Hideki Kitagawa, Sakai, JP;

Tohru Daitoh, Sakai, JP;

Hajime Imai, Sakai, JP;

Masahiko Suzuki, Sakai, JP;

Setsuji Nishimiya, Sakai, JP;

Tetsuo Kikuchi, Sakai, JP;

Toshikatsu Itoh, Sakai, JP;

Kengo Hara, Sakai, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01); H01L 29/66 (2006.01); H01L 27/32 (2006.01); G02F 1/1362 (2006.01);
U.S. Cl.
CPC ...
H01L 27/3262 (2013.01); G02F 1/136277 (2013.01); G02F 1/136286 (2013.01); H01L 27/3258 (2013.01); H01L 27/3276 (2013.01);
Abstract

An oxide semiconductor TFT () of an active matrix substrate includes an oxide semiconductor layer (), an upper gate electrode () disposed on a part of the oxide semiconductor layer via a gate insulating layer, and a source electrode () and a drain electrode (). As viewed from a normal direction of the substrate, the oxide semiconductor layer () includes a first portion (p) that overlaps the upper gate electrode, and a second portion (p) that is located between the first portion and the source contact region or drain contact region, such that the gate insulating layer does not cover the second portion. The upper gate electrode () has a multilayer structure including an alloy layer (L) that is in contact with the gate insulating layer and a metal layer (U) that is disposed on the alloy layer. The metal layer is made of a first metallic element M; the alloy layer is made of an alloy containing the first metallic element M; and the first metallic element M is Cu, Mo, or Cr.


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