The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2021
Filed:
Apr. 19, 2019
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Takaaki Hirano, Kanagawa, JP;
Shinji Miyazawa, Kanagawa, JP;
Kensaku Maeda, Kanagawa, JP;
Yusuke Moriya, Kanagawa, JP;
Shunsuke Furuse, Kanagawa, JP;
Yutaka Ooka, Kanagawa, JP;
Assignee:
SONY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H04N 5/374 (2011.01);
U.S. Cl.
CPC ...
H01L 27/14627 (2013.01); H01L 27/1464 (2013.01); H01L 27/14618 (2013.01); H01L 27/14623 (2013.01); H01L 27/14685 (2013.01); H04N 5/374 (2013.01);
Abstract
Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan.