The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2021

Filed:

Apr. 09, 2020
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Yong Ho Baek, Suwon-si, KR;

Jung Hyun Cho, Suwon-si, KR;

Min Keun Kim, Suwon-si, KR;

Young Sik Hur, Suwon-si, KR;

Tae Hee Han, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 27/32 (2006.01); H01L 23/00 (2006.01); G02B 5/20 (2006.01); G06K 9/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14618 (2013.01); G02B 5/208 (2013.01); G06K 9/0004 (2013.01); H01L 24/20 (2013.01); H01L 27/1462 (2013.01); H01L 27/14627 (2013.01); H01L 27/14636 (2013.01); H01L 27/14643 (2013.01); H01L 27/14689 (2013.01); H01L 27/3234 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/214 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3511 (2013.01);
Abstract

There are provided a fan-out sensor package and an optical fingerprint sensor module including the same. The fan-out sensor package includes: a connection member having athrough-hole; an image sensor disposed in the through-hole of the connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the connection member, the image sensor, andan optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens. The connection member includes a wiring layer, and the redistribution layer electrically connects the wiring layer and the connection pads to each other.


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