The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2021

Filed:

Feb. 11, 2020
Applicant:

Facebook Technologies, Llc, Menlo Park, CA (US);

Inventor:

Rajendra D. Pendse, Fremont, CA (US);

Assignee:

FACEBOOK TECHNOLOGIES, LLC, Menlo Park, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 23/481 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 24/24 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/05 (2013.01); H01L 2224/05025 (2013.01); H01L 2224/16 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/24 (2013.01); H01L 2224/24137 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/1426 (2013.01);
Abstract

An IC chip comprises LED devices exposed on a front side of the IC chip, I/O bumps on a back side of the IC chip, a first die forming a stack with the LED devices and comprising driver circuits electrically connected to the LED devices, a first circuit that extends along the vertical direction from the front side of the IC chip towards a back side of the IC chip and across at least a thickness of the first die to provide electrical connections between the LED devices and at least some of the I/O bumps, a second die including pipelining circuits and control circuits for the driver circuits, a second circuit that extends from the second die, and a circuit board electrically connected to the I/O bumps and to a power system.


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