The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2021

Filed:

Mar. 16, 2020
Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventors:

Leslie Paul Wallis, Ottawa, CA;

Hoang Mong Nguyen, Fountain Valley, CA (US);

Anthony James LoBianco, Irvine, CA (US);

Gregory Edward Babcock, Ottawa, CA;

Darren Roger Frenette, Pakenham, CA;

George Khoury, Ottawa, CA;

René Rodríguez, Rancho Santa Margarita, CA (US);

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/38 (2015.01); H01L 23/66 (2006.01); H03F 3/24 (2006.01); H03F 1/32 (2006.01); H01L 23/552 (2006.01); H04B 1/40 (2015.01); H03F 3/195 (2006.01); H03F 1/22 (2006.01); H03F 1/34 (2006.01); H03F 1/56 (2006.01); H04B 1/04 (2006.01); H05B 47/19 (2020.01); F21V 23/00 (2015.01); H04W 84/12 (2009.01); H01Q 1/38 (2006.01); H01Q 1/22 (2006.01); H01Q 9/42 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); F21V 23/006 (2013.01); H01L 23/552 (2013.01); H03F 1/223 (2013.01); H03F 1/32 (2013.01); H03F 1/3205 (2013.01); H03F 1/347 (2013.01); H03F 1/565 (2013.01); H03F 3/195 (2013.01); H03F 3/245 (2013.01); H04B 1/0475 (2013.01); H04B 1/40 (2013.01); H05B 47/19 (2020.01); H01L 2223/665 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48195 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/19104 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/38 (2013.01); H01Q 9/42 (2013.01); H03F 2200/222 (2013.01); H03F 2200/294 (2013.01); H03F 2200/451 (2013.01); H03F 2200/534 (2013.01); H04B 2001/0433 (2013.01); H04W 84/12 (2013.01);
Abstract

Front end systems and related devices, integrated circuits, modules, and methods are disclosed. One such packaged module includes a low noise amplifier in an interior of a radio frequency shielding structure and an antenna external to the radio frequency shielding structure. The low noise amplifier includes a first inductor, an amplification circuit, and a second inductor magnetically coupled to the first inductor to provide negative feedback to linearize the low noise amplifier. The radio frequency shielding structure can extend above a package substrate. The antenna can be on the package substrate. Other embodiments of front end systems are disclosed, along with related devices, integrated circuits, modules, methods, and components thereof.


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