The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2021

Filed:

May. 19, 2017
Applicant:

Shindengen Electric Manufacturing Co., Ltd., Tokyo, JP;

Inventors:

Kosuke Ikeda, Hanno, JP;

Osamu Matsuzaki, Hanno, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49833 (2013.01); H01L 21/4842 (2013.01); H01L 21/4853 (2013.01); H01L 23/3107 (2013.01); H01L 23/367 (2013.01); H01L 23/49555 (2013.01); H01L 23/49811 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 25/074 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01);
Abstract

An electronic module has a first substrate, a first electronic element, a second electronic element, a second substrate, a first terminal partand a second terminal part. The first terminal parthas a first terminal base end part, a first terminal outer part, and a first bending partthat is provided between the first terminal base end partand the first terminal outer partand that is bent toward the other side on a side of the first terminal base end part. The second terminal parthas a second terminal base end part, a second terminal outer part, and a second bending partthat is provided between the second terminal base end partand the second terminal outer partand that is bent toward one side on a side of the second terminal base end part


Find Patent Forward Citations

Ikeda, Kosuke. (2021). Electronic module, lead frame and manufacturing method for electronic module (U.S. Patent No. 11037870). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11037870

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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