The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2021

Filed:

May. 23, 2016
Applicant:

Siemens Aktiengesellschaft, Munich, DE;

Inventors:

Hubert Baueregger, Kissing, DE;

Volkmar Sommer, Munich, DE;

Stefan Stegmeier, Munich, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/49 (2006.01); H01L 23/50 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); C25D 3/38 (2006.01); C25D 5/18 (2006.01); C25D 21/14 (2006.01); H05K 3/42 (2006.01); H01L 23/492 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49 (2013.01); C25D 3/38 (2013.01); C25D 5/18 (2013.01); C25D 21/14 (2013.01); H01L 23/4922 (2013.01); H01L 23/49537 (2013.01); H01L 23/49562 (2013.01); H01L 23/49568 (2013.01); H01L 23/49811 (2013.01); H01L 23/50 (2013.01); H01L 24/24 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/41 (2013.01); H01L 24/75 (2013.01); H01L 24/77 (2013.01); H01L 24/82 (2013.01); H01L 24/83 (2013.01); H01L 24/84 (2013.01); H01L 24/92 (2013.01); H01L 24/97 (2013.01); H05K 3/424 (2013.01); H01L 23/3733 (2013.01); H01L 23/3735 (2013.01); H01L 23/49513 (2013.01); H01L 24/05 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/04034 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/24105 (2013.01); H01L 2224/24227 (2013.01); H01L 2224/24245 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/3207 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/373 (2013.01); H01L 2224/37005 (2013.01); H01L 2224/376 (2013.01); H01L 2224/3719 (2013.01); H01L 2224/3729 (2013.01); H01L 2224/37111 (2013.01); H01L 2224/37124 (2013.01); H01L 2224/37139 (2013.01); H01L 2224/37144 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/37155 (2013.01); H01L 2224/37166 (2013.01); H01L 2224/37211 (2013.01); H01L 2224/37224 (2013.01); H01L 2224/37239 (2013.01); H01L 2224/37244 (2013.01); H01L 2224/37247 (2013.01); H01L 2224/37255 (2013.01); H01L 2224/37266 (2013.01); H01L 2224/37395 (2013.01); H01L 2224/4007 (2013.01); H01L 2224/40227 (2013.01); H01L 2224/40499 (2013.01); H01L 2224/756 (2013.01); H01L 2224/75703 (2013.01); H01L 2224/776 (2013.01); H01L 2224/77703 (2013.01); H01L 2224/821 (2013.01); H01L 2224/82101 (2013.01); H01L 2224/831 (2013.01); H01L 2224/834 (2013.01); H01L 2224/836 (2013.01); H01L 2224/83007 (2013.01); H01L 2224/8349 (2013.01); H01L 2224/8359 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83411 (2013.01); H01L 2224/83424 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83455 (2013.01); H01L 2224/83466 (2013.01); H01L 2224/83511 (2013.01); H01L 2224/83524 (2013.01); H01L 2224/83539 (2013.01); H01L 2224/83544 (2013.01); H01L 2224/83547 (2013.01); H01L 2224/83555 (2013.01); H01L 2224/83566 (2013.01); H01L 2224/83695 (2013.01); H01L 2224/83907 (2013.01); H01L 2224/841 (2013.01); H01L 2224/84007 (2013.01); H01L 2224/8485 (2013.01); H01L 2224/8492 (2013.01); H01L 2224/84951 (2013.01); H01L 2224/9201 (2013.01); H01L 2224/9205 (2013.01); H01L 2224/9221 (2013.01); H01L 2224/97 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01);
Abstract

The invention relates to a method for electrically contacting a component () (for example a power component and/or a (semiconductor) component having at least one transistor, preferably an IGBT (insulated-gate bipolar transistor)) having at least one contact (), at least one open-pored contact piece () is galvanically (electrochemically or free of external current) connected to at least one contact (). In this way, a component module is achieved. The contact () is preferably a flat part or has a contact surface, the largest planar extent thereof being greater than an extension of the contact () perpendicular to said contact surface. The temperature of the galvanic connection is at most 100° C., preferably at most 60° C., advantageously at most 20° C. and ideally at most 5° C. and/or deviates from the operating temperature of the component by at most 50° C., preferably by at most 20° C., in particular by at most 10° C. and ideally by at most 5° C., preferably by at most 2° C. The component () can be contacted by means of the contact piece () with a further component, a current conductor and/or a substrate (). Preferably, a component () having two contacts () on opposite sides of the component () is used, wherein at least one open-pored contact piece () is galvanically connected to each contact ().


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