The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2021

Filed:

Nov. 28, 2018
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventors:

Yuhei Nishida, Matsumoto, JP;

Tatsuo Nishizawa, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/08 (2006.01); H05K 1/11 (2006.01); H05K 1/05 (2006.01); H01L 23/532 (2006.01); H01L 21/56 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3142 (2013.01); H01L 21/565 (2013.01); H01L 23/08 (2013.01); H01L 23/3735 (2013.01); H01L 23/5329 (2013.01); H01L 24/00 (2013.01); H05K 1/05 (2013.01); H05K 1/119 (2013.01); H01L 23/3121 (2013.01);
Abstract

A semiconductor module includes block-shaped first and second lower base members provided by bonding of flat lower surfaces on an insulated circuit board and having bottomed first and second hole portions open in upper surfaces in upper portions of the first and second lower base members, tubular first and second upper slide support members inserted in the first and second hole portions in a state where at least a part of outside surfaces is in contact with inside walls of the first and second hole portions, first and second pins inserted in contact with the insides of the first and second upper slide support members, and a sealing resin sealing the first and second pins except for the upper portions of the first and second pins.


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