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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11037844 B1

PDFFull Text
Date of Patent:
Jun. 15, 2021

Filed:

Dec. 29, 2017

Power semiconductor device and method of manufacturing the same, and power conversion device

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Satoshi Kondo, Tokyo, JP;

Yusuke Kaji, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Mark W Tornow

Assistant Examiner:

Abbigale A Boyle

Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 23/24 (2006.01); H01L 21/54 (2006.01); H01L 23/22 (2006.01); H01L 23/053 (2006.01); H01L 23/047 (2006.01); H01L 21/52 (2006.01); H01L 23/14 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H02M 7/00 (2006.01); H01L 23/367 (2006.01); H02M 7/5387 (2007.01);
U.S. Cl.
CPC ...
H01L 23/041 (2013.01); H01L 21/52 (2013.01); H01L 21/54 (2013.01); H01L 23/04 (2013.01); H01L 23/047 (2013.01); H01L 23/053 (2013.01); H01L 23/142 (2013.01); H01L 23/22 (2013.01); H01L 23/24 (2013.01); H01L 23/3121 (2013.01); H01L 23/49844 (2013.01); H01L 23/367 (2013.01); H01L 2224/33 (2013.01); H02M 7/003 (2013.01); H02M 7/5387 (2013.01);
Abstract

A power semiconductor device includes a casing, a first insulating circuit board, a second insulating circuit board, and a sealing material. The first insulating circuit board is disposed to be surrounded by the casing. The second insulating circuit board is surrounded by the casing and spaced from the first insulating circuit board so as to sandwich a semiconductor element between the first insulating circuit board and the second insulating circuit board. The sealing material fills a region surrounded by the casing. The first or second insulating circuit board is provided with a hole extending from one main surface to the other main surface opposite to one main surface. From at least a portion of an inner wall surface of the casing a protrusion extending to a region overlapping the first or second insulating circuit board in a plan view extends toward the region surrounded by the casing.

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