The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2021
Filed:
Nov. 06, 2019
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Yuji Kawasaki, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); H01L 21/78 (2013.01); H01L 22/30 (2013.01);
Abstract
A plurality of semiconductor devices () are formed on a semiconductor wafer (). A film thickness measurement wiring pattern () is formed on a dicing line () defining the plurality of semiconductor devices (). An SOG film () is formed on the semiconductor devices () and the film thickness measurement wiring pattern (). A film thickness of the SOG film () at a central part of the film thickness measurement wiring pattern () is measured. The film thickness measurement wiring pattern () is a rectangular pattern having long sides parallel to the dicing line ().