The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2021

Filed:

Jan. 31, 2020
Applicant:

Alps Alpine Co., Ltd., Tokyo, JP;

Inventors:

Takahiro Umezu, Santa Clara, CA (US);

Takaki Tanaka, Miyagi, JP;

Keiko Natsuizaka, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01H 13/52 (2006.01); H01C 13/02 (2006.01); H01H 11/00 (2006.01); H01H 11/06 (2006.01); H01H 13/10 (2006.01); H01H 13/18 (2006.01);
U.S. Cl.
CPC ...
H01H 13/52 (2013.01); H01C 13/02 (2013.01); H01H 11/0056 (2013.01); H01H 11/06 (2013.01); H01H 13/10 (2013.01); H01H 13/186 (2013.01); H01H 2011/0087 (2013.01); H01H 2013/525 (2013.01); H01H 2229/04 (2013.01); H01H 2229/048 (2013.01);
Abstract

A switch includes a housing, a switching mechanism housed in the housing and configured to switch a state of connection between at least two terminals exposed out of the housing by using a common contact and two switching contacts, and an electronic component that is disposed in the housing and electrically connects the terminals to each other. The switching mechanism includes a first metal plate that is connected to a first contact, which is one of the common contact and the two switching contacts, and includes a first exposed part to which a first electrode of the electronic component is soldered by laser irradiation, and a second metal plate that is connected to a second contact, which is another one of the common contact and the two switching contacts, and includes a second exposed part to which a second electrode of the electronic component is soldered by laser irradiation.


Find Patent Forward Citations

Loading…