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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11037730 B1

PDFFull Text
Date of Patent:
Jun. 15, 2021

Filed:

Nov. 26, 2018

Electronic component having metal frames with insulating layers thereon

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Ho Yoon Kim, Suwon-si, KR;

Woo Chul Shin, Suwon-si, KR;

Sang Soo Park, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;

Attorney:

Morgan, Lewis & Bockius LLP

Primary Examiner:

David M Sinclair

Int. Cl.
CPC ...
H01G 4/224 (2006.01); H01G 4/232 (2006.01); H01G 4/248 (2006.01); H01G 4/30 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/008 (2006.01);
U.S. Cl.
CPC ...
H01G 4/224 (2013.01); H01G 4/2325 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1227 (2013.01); H01G 4/1245 (2013.01);
Abstract

An electronic component includes a body; first and second external electrodes including first and second connection portions and first and second band portions, respectively; and first and second metal frames connected to the first and second external electrodes, respectively, wherein the first and second metal frames include first and second support portions bonded to the first and second connection portions, and first and second mounting portions extended in the first direction from lower ends of the first and second support portions and spaced apart from the body and the first and second external electrodes, and further include first and second insulating layers formed on external surfaces of the first and second support portions.

Find Patent Forward Citations

Kim, Ho. (2021). Electronic component having metal frames with insulating layers thereon (U.S. Patent No. 11037730). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11037730

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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