The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2021

Filed:

Sep. 05, 2019
Applicant:

Coretronic Corporation, Hsin-Chu, TW;

Inventors:

Wen-Yen Chung, Hsin-Chu, TW;

Yi-Han Lai, Hsin-Chu, TW;

Assignee:

Coretronic Corporation, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03B 21/16 (2006.01); G03B 21/14 (2006.01); G03B 21/20 (2006.01); H04N 9/31 (2006.01); F28D 1/02 (2006.01); F28D 15/02 (2006.01); H05K 7/20 (2006.01); H01B 7/42 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
G03B 21/16 (2013.01); F28D 1/024 (2013.01); F28D 15/02 (2013.01); G03B 21/145 (2013.01); G03B 21/2033 (2013.01); H01B 7/426 (2013.01); H05K 7/20136 (2013.01); H05K 7/20336 (2013.01); F28D 2021/0029 (2013.01); H04N 9/3114 (2013.01);
Abstract

A heat dissipation module and a projection apparatus are provided. The heat dissipation module dissipates the heat generated by a plurality of heating elements, includes a heat pipe, a heat dissipation plate, a first and a second heat dissipation fins. The heat pipe includes a first portion of the heat pipe passes through the first heat dissipation fin and a second portion of the heat pipe passes through the second heat dissipation fin and a third portion connected with the first and the second portions. The third portion of the heat pipe and the heating elements are connected to the heat dissipation plate. The heat generated by the heating elements is dissipated by the heat dissipation plate, the first and the second heat dissipation fins through thermal conduction method and thermal convection method. The invention saves accommodating space in the projection apparatus and has an efficient heat dissipation effect.


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