The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2021

Filed:

Mar. 07, 2018
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Ernst Wolfgang Stautner, Niskayuna, NY (US);

Eric George Budesheim, Wynantskill, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 24/08 (2006.01); F25D 19/00 (2006.01); F25D 29/00 (2006.01); F28F 13/00 (2006.01); F28F 21/08 (2006.01); G01N 1/42 (2006.01); G01N 35/00 (2006.01); G01R 33/28 (2006.01); G01R 33/31 (2006.01);
U.S. Cl.
CPC ...
G01N 24/08 (2013.01); F25D 19/006 (2013.01); F25D 29/001 (2013.01); F28F 13/00 (2013.01); F28F 21/085 (2013.01); F28F 21/086 (2013.01); G01N 1/42 (2013.01); G01N 35/00 (2013.01); G01R 33/282 (2013.01); G01R 33/31 (2013.01); F28F 2013/008 (2013.01);
Abstract

A cooling system, an apparatus for producing hyperpolarized samples, where the apparatus includes the cooling system, and a method for assembling and using the cooling system are disclosed. The cooling system includes a cryogenic chamber, a cooling plate, a sample sleeve, a thermal switch, and an interposer. Also, the cryogenic chamber includes a cryogenic fluid and the cooling plate is disposed in the cryogenic chamber, in contact with the cryogenic fluid. Further, the sample sleeve is configured to receive a sample. The sample sleeve is at least partially inserted in the cryogenic chamber. The thermal switch is disposed between the cooling plate and the sample sleeve. Moreover, the interposer is disposed between at least one of (i) the thermal switch and the cooling plate and (ii) the thermal switch and the sample sleeve. The interposer includes a gallium indium tin alloy.


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Stautner, Ernst. (2021). Thermal interposer for a cryogenic cooling system (U.S. Patent No. 11035807). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11035807

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