The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2021
Filed:
Dec. 19, 2018
Applicant:
Soulbrain Co., Ltd., Seongnam-si, KR;
Inventors:
Jong Cheol Yun, Seongnam-si, KR;
Wan Joong Kim, Seongnam-si, KR;
Hee Jeong Ryu, Seongnam-si, KR;
Seung Min Park, Seongnam-si, KR;
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/02 (2006.01); C25D 3/38 (2006.01); C07D 473/38 (2006.01); C07D 239/48 (2006.01); C07D 239/58 (2006.01);
U.S. Cl.
CPC ...
C25D 3/38 (2013.01); C07D 239/48 (2013.01); C07D 239/58 (2013.01); C07D 473/38 (2013.01);
Abstract
The present invention relates to a electroplating composition and an electroplating method using the same. The electroplating composition of the present invention comprising a first leveling agent and a second leveling agent, wherein the first leveling agent and the second leveling agent each, independently, comprise a compound represented by Chemical Formula 1 below: