The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2021
Filed:
Jan. 14, 2019
Applicant:
Honeywell International Inc., Morris Plains, NJ (US);
Inventors:
Stephane Ferrasse, Spokane, WA (US);
Frank C. Alford, Spokane Valley, WA (US);
Ira G. Nolander, Spokane, WA (US);
Erik L. Turner, Spokane, WA (US);
Patrick Underwood, Spokane, WA (US);
Assignee:
Honeywell International Inc., Charlotte, NC (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); C22C 9/05 (2006.01); C22F 1/08 (2006.01); B21J 1/00 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3414 (2013.01); B21J 1/00 (2013.01); C22C 9/05 (2013.01); C22F 1/08 (2013.01);
Abstract
A method of forming a copper manganese sputtering target including subjecting a copper manganese billet to a first unidirectional forging step, heating the copper manganese billet to a temperature from about 650° C. to about 750° C., subjecting the copper manganese billet to a second unidirectional forging step, and heating the copper manganese billet to a temperature from about 500° C. to about 650° C. to form a copper alloy.