The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2021

Filed:

Dec. 03, 2015
Applicant:

Oerlikon Surface Solutions Ag, Pfäffikon, Pfäffikon, CH;

Inventors:

Anders Olof Eriksson, Chur, CH;

Mirjam Arndt, Bad Ragaz, CH;

Sebastian Stein, Achern, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/06 (2006.01); C23C 14/32 (2006.01); C23C 28/04 (2006.01); C23C 14/02 (2006.01); C23C 14/00 (2006.01); C23C 28/00 (2006.01);
U.S. Cl.
CPC ...
C23C 14/0647 (2013.01); C23C 14/0021 (2013.01); C23C 14/024 (2013.01); C23C 14/0641 (2013.01); C23C 14/325 (2013.01); C23C 28/042 (2013.01); C23C 28/044 (2013.01); C23C 28/42 (2013.01);
Abstract

Coating () deposited on a surface of a substrate () comprising a multi-layered film () consisting of a plurality of A-layers and a plurality of B-layers deposited alternating one on each other forming a A/B/A/B/A . . . architecture, the A-layers comprising aluminium chromium boron nitride and the B-layers comprising aluminium chromium nitride and not comprising boron, whereas the multi-layered film () comprises at least a first portion () and a last portion (), wherein the average boron content in the first coating portion () is higher than the average boron content in the last coating portion (), and both the first coating portion () and the last coating portion () exhibit inherent compressive stresses and wherein the inherent compressive stress in the first coating portion () is lower than it in the last coating portion ().


Find Patent Forward Citations

Loading…