The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2021

Filed:

Nov. 21, 2017
Applicant:

Dow Toray Co., Ltd., Tokyo, JP;

Inventors:

Shuji Endo, Ichihara, JP;

Takatoshi Toyama, Ichihara, JP;

Tsugio Nozoe, Ichihara, JP;

Assignee:

DOW TORAY CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 9/28 (2006.01); C08J 9/00 (2006.01); C08L 83/04 (2006.01);
U.S. Cl.
CPC ...
C08J 9/286 (2013.01); C08J 9/0042 (2013.01); C08J 9/0061 (2013.01); C08J 9/0066 (2013.01); C08L 83/04 (2013.01); C08J 2201/028 (2013.01); C08J 2201/0504 (2013.01); C08J 2205/044 (2013.01); C08J 2205/05 (2013.01); C08J 2383/07 (2013.01); C08J 2483/07 (2013.01); C08L 2201/52 (2013.01); C08L 2203/14 (2013.01); C08L 2312/00 (2013.01);
Abstract

A sponge-forming liquid silicone rubber composition is provided. The composition generally maintains a stable emulsified state, can form a low-density silicone rubber sponge having a uniform and fine open-cell foam structure even when a coating or molding method involving shearing force and thin layer formation is used, is less likely to contract during curing, and that forms a silicone rubber sponge having a density close to the density designed on the basis of water content. A low-density silicone rubber sponge material using the sponge-forming liquid silicone rubber composition is also provided. The sponge-forming liquid silicone rubber composition comprises (A) an alkenyl group-containing organopolysiloxane, (B) an organopolysiloxane having a silicon atom-bonded hydrogen atom, (C) a mixture of water and an inorganic thickener, (D) an emulsifier, and (E) a hydrosilylation reaction catalyst. The contained amount of the component (C) in the entire composition is 70 mass % or more.


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