The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2021
Filed:
Feb. 24, 2016
Applicant:
Toray Industries, Inc., Tokyo, JP;
Inventors:
Tomohiro Takehara, Ehime, JP;
Satoshi Seike, Aichi, JP;
Masato Honma, Ehime, JP;
Naokichi Imai, Ehime, JP;
Satomi Hiasa, Ehime, JP;
Assignee:
Toray Industries, Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08J 5/24 (2006.01); C08J 5/04 (2006.01); B29C 70/18 (2006.01); B29C 70/54 (2006.01); B29C 70/46 (2006.01); B29C 70/40 (2006.01); B29K 63/00 (2006.01); B29K 307/04 (2006.01);
U.S. Cl.
CPC ...
C08J 5/24 (2013.01); B29C 70/18 (2013.01); B29C 70/40 (2013.01); B29C 70/465 (2013.01); B29C 70/547 (2013.01); C08J 5/04 (2013.01); C08J 5/042 (2013.01); B29K 2063/00 (2013.01); B29K 2307/04 (2013.01); B29K 2905/00 (2013.01); C08J 2323/12 (2013.01); C08J 2363/02 (2013.01); C08J 2400/20 (2013.01);
Abstract
A resin supply material used for press molding or vacuum-pressure molding of a fiber-reinforced resin, the resin supply material including a continuous porous material and a thermosetting resin, wherein an average pore cross-sectional area ratio P expressed by formula (I) is 1.1 or more:  (I)