The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2021

Filed:

Mar. 28, 2018
Applicant:

Denka Company Limited, Tokyo, JP;

Inventors:

Saori Inoue, Omuta, JP;

Toshitaka Yamagata, Omuta, JP;

Yoshitaka Minakata, Omuta, JP;

Ryo Yoshimatsu, Omuta, JP;

Ryuji Koga, Omuta, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C04B 35/583 (2006.01); H01L 23/34 (2006.01); C04B 41/83 (2006.01); H01L 23/373 (2006.01); C04B 111/00 (2006.01);
U.S. Cl.
CPC ...
C04B 35/583 (2013.01); C04B 41/83 (2013.01); H01L 23/345 (2013.01); H01L 23/373 (2013.01); C04B 2111/00465 (2013.01); C04B 2235/386 (2013.01);
Abstract

A thermal conductive member includes: first and second surface layers including an insulating material A, and an intermediate layer including an insulating material B. The insulating material A includes a first boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.6 to 1.4, and a first heat curable resin composition impregnating in the first boron nitride sintered body. The insulating material B includes a second boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.01 to 0.05, and a second heat curable resin composition impregnating in the second boron nitride sintered body.


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