The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2021

Filed:

Dec. 08, 2017
Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

Zachary B. Renwick, Saint Louis, MO (US);

Brandon L. Bertolucci, Seattle, WA (US);

Eric Herrera, Mukilteo, WA (US);

Michael William Hayes, Belleville, IL (US);

John C. Waldrop, III, St. Peters, MO (US);

Matthew Scott Thompson, Madison, AL (US);

Assignee:

The Boeing Company, Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B64D 33/02 (2006.01); B33Y 80/00 (2015.01); B33Y 10/00 (2015.01); G10K 11/172 (2006.01); B29C 64/106 (2017.01); B29D 99/00 (2010.01); B33Y 30/00 (2015.01); G10K 11/168 (2006.01); B29K 701/12 (2006.01); B29L 7/00 (2006.01);
U.S. Cl.
CPC ...
B64D 33/02 (2013.01); B29C 64/106 (2017.08); B29D 99/0089 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 80/00 (2014.12); G10K 11/168 (2013.01); G10K 11/172 (2013.01); B29K 2701/12 (2013.01); B29L 2007/002 (2013.01); B32B 2260/023 (2013.01); B32B 2307/10 (2013.01); B32B 2605/18 (2013.01); B64D 2033/0206 (2013.01); B64D 2033/0286 (2013.01);
Abstract

Systems and methods are provided for septa for acoustic cells. One embodiment is a method that includes fabricating a septum of a cell of an acoustic panel, by heating a material into a molten material, depositing the molten material to form a lower chamber of the septum that extends vertically upwards and includes an entry, iteratively depositing layers of the molten material, each layer comprising a filament at the entry that includes overhangs with respect to vertically adjacent layers, and forming openings at locations of the overhangs.


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