The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2021
Filed:
Aug. 23, 2018
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Koichi Saito, Matsumoto, JP;
Kohei Yuwaki, Shiojiri, JP;
Shunsuke Mizukami, Hokuto, JP;
Kazuhide Nakamura, Asahi, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/209 (2017.01); B33Y 30/00 (2015.01); B22F 3/00 (2021.01); B29C 64/35 (2017.01); B29C 64/106 (2017.01); B22F 10/10 (2021.01); B28B 1/00 (2006.01);
U.S. Cl.
CPC ...
B29C 64/209 (2017.08); B22F 10/10 (2021.01); B28B 1/001 (2013.01); B29C 64/106 (2017.08); B29C 64/35 (2017.08); B33Y 30/00 (2014.12);
Abstract
Provided is a shaping material supply device for use in a three-dimensional shaping apparatus, which includes a first flow path through which a shaping material flows, a nozzle that communicates with the first flow path and discharges the shaping material, and a flow rate regulation mechanism that includes a butterfly valve provided in the first flow path.