The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2021
Filed:
Nov. 29, 2018
Low cost approach for depositing solder and adhesives in a pattern for forming electronic assemblies
Applicant:
Raytheon Company, Waltham, MA (US);
Inventors:
Sergio V. Martinez, Sahuarita, AZ (US);
Jeffrey R. Ogorzalek, Attleboro, MA (US);
Patrick J. Lott, Lowell, MA (US);
Assignee:
RAYTHEON COMPANY, Waltham, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 37/06 (2006.01); B23K 3/06 (2006.01); H05K 3/32 (2006.01); H05K 3/34 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 37/06 (2013.01); B23K 1/0016 (2013.01); B23K 3/0638 (2013.01); H05K 3/323 (2013.01); H05K 3/3436 (2013.01); B23K 2101/42 (2018.08); H05K 2203/0126 (2013.01);
Abstract
A method for depositing a material to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area of a substrate, a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool to deposit the material in the deposition pattern that extends across the pad area of the substrate.