The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2021
Filed:
Jan. 09, 2015
Applicant:
United Technologies Corporation, Farmington, CT (US);
Inventors:
Ying She, East Hartford, CT (US);
Aaron T. Nardi, East Granby, CT (US);
Zissis A. Dardas, Worcester, MA (US);
Michael A. Klecka, Coventry, CT (US);
Scott A. Eastman, Glastonbury, CT (US);
Assignee:
Raytheon Technologies Corporation, Farmington, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/02 (2006.01); B22F 1/00 (2006.01); B33Y 70/00 (2020.01); B22F 10/10 (2021.01); B22F 12/00 (2021.01); B23K 26/342 (2014.01); B22F 3/00 (2021.01); B22F 3/10 (2006.01); B23K 15/00 (2006.01); B23K 26/00 (2014.01); B23K 103/04 (2006.01); B23K 103/10 (2006.01); B23K 103/12 (2006.01); B23K 103/14 (2006.01); B23K 103/16 (2006.01); B23K 103/00 (2006.01); B33Y 10/00 (2015.01);
U.S. Cl.
CPC ...
B22F 1/02 (2013.01); B22F 1/0059 (2013.01); B22F 1/0062 (2013.01); B22F 3/003 (2013.01); B22F 3/1017 (2013.01); B22F 12/00 (2021.01); B23K 15/0086 (2013.01); B23K 15/0093 (2013.01); B23K 26/0006 (2013.01); B23K 26/342 (2015.10); B33Y 70/00 (2014.12); B22F 10/10 (2021.01); B22F 2301/052 (2013.01); B22F 2301/10 (2013.01); B22F 2301/15 (2013.01); B22F 2301/205 (2013.01); B22F 2302/20 (2013.01); B22F 2302/45 (2013.01); B22F 2998/10 (2013.01); B23K 2103/04 (2018.08); B23K 2103/10 (2018.08); B23K 2103/12 (2018.08); B23K 2103/14 (2018.08); B23K 2103/16 (2018.08); B23K 2103/42 (2018.08); B23K 2103/52 (2018.08); B33Y 10/00 (2014.12); Y02P 10/25 (2015.11);
Abstract
Material is provided for forming a part using a manufacturing system. The material includes a plurality of discrete particles. Each of the particles includes a metal powder core encapsulated by a non-metal coating. At least the cores of the particles are adapted to be solidified together by the manufacturing system to form the part.