The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2021

Filed:

Mar. 07, 2016
Applicant:

Samsung Medison Co., Ltd., Gangwon-do, KR;

Inventors:

Gil-ju Jin, Gangwon-do, KR;

Ho-san Han, Seoul, KR;

Dong-hyun Kim, Gangwon-do, KR;

Mi-Jeoung Ahn, Gangwon-do, KR;

Assignee:

SAMSUNG MEDISON CO., LTD., Gangwon-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 8/00 (2006.01); A61B 8/14 (2006.01); A61B 8/08 (2006.01); G01S 7/52 (2006.01); G10K 11/30 (2006.01);
U.S. Cl.
CPC ...
A61B 8/546 (2013.01); A61B 8/00 (2013.01); A61B 8/08 (2013.01); A61B 8/14 (2013.01); A61B 8/4444 (2013.01); A61B 8/5207 (2013.01); A61B 8/56 (2013.01); G01S 7/52079 (2013.01); G10K 11/30 (2013.01); A61B 8/4405 (2013.01); A61B 8/4438 (2013.01); A61B 8/4472 (2013.01);
Abstract

Provided is an ultrasound probe. The ultrasound probe may maintain temperature of an acoustic module predetermined temperature or less even when an image processor is disposed in a rear direction of the acoustic module inside a housing. For purpose, the ultrasound probe may include at least one anisotropic heat conductive member such that heat from the acoustic module is transferred to a first heat sink member disposed in a rear direction of the image processor.


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