The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 2021

Filed:

Apr. 25, 2019
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventor:

Jason Allen Harrigan, Sultan, WA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 9/00 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0024 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H05K 3/341 (2013.01); H05K 3/3494 (2013.01); H05K 3/368 (2013.01); H05K 2201/042 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10371 (2013.01); H05K 2203/166 (2013.01);
Abstract

An electronic assembly includes a first printed circuit board (PCB), a second PCB, and a grounding shield. The first PCB includes a first plurality of electronic components and a first conductive layer. The second PCB includes a second plurality of electronic components and a second conductive layer. The grounding shield is electrically connected between the first conductive layer of the first PCB and the second conductive layer of the second PCB to electrically connect the first PCB and the second PCB. The first PCB and the second PCB are arranged in a stack such that the first conductive layer and the second conductive layer mutually shield at least one of the first plurality of electronic components and at least one of the second plurality of electronic components from electromagnetic interference.


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