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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11032942 B1

PDFFull Text
Date of Patent:
Jun. 08, 2021

Filed:

Sep. 25, 2014

Structure for a heat transfer interface and method of manufacturing the same

Applicant:

Alcatel-lucent, Boulogne-billancourt, FR;

Inventors:

Roger Scott Kempers, Toronto, CA;

Paul Ahern, Clonee, IE;

Alan Michael Lyons, New Providence, NJ (US);

Anthony Robinson, Laytown, IE;

Assignee:

Alcatel Lucent, Nozay, FR;

Attorney:

Nokia Technologies Oy

Primary Examiner:

Courtney L Smith

Int. Cl.
CPC ...
H05K 7/20 (2006.01); B21D 13/02 (2006.01); B21D 53/04 (2006.01); B21D 33/00 (2006.01); H01L 23/433 (2006.01); H01L 23/42 (2006.01); H01L 23/373 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01); F28F 13/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); B21D 13/02 (2013.01); B21D 33/00 (2013.01); B21D 53/04 (2013.01); H01L 21/4878 (2013.01); H01L 23/367 (2013.01); H01L 23/3735 (2013.01); H01L 23/42 (2013.01); H01L 23/433 (2013.01); F28F 2013/006 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A heat transfer interface structure and a method of manufacturing the same are disclosed. A substrate has a plurality of raised features formed on at least one surface the substrate. The raised features are deformable under a compressive force and have respective openings at end portions thereof. A thickness of a raised feature at the end portion thereof is smaller than a thickness of the raised feature at an intermediate portion of the raised feature.

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Quick Actions:

Kempers, Roger. (2021). Structure for a heat transfer interface and method of manufacturing the same (U.S. Patent No. 11032942). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11032942

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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