The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 2021

Filed:

Nov. 06, 2017
Applicant:

Nitto Denko Corporation, Osaka, JP;

Inventors:

Shusaku Shibata, Osaka, JP;

Takahiro Takano, Osaka, JP;

Hayato Takakura, Osaka, JP;

Yoshihiro Kawamura, Osaka, JP;

Shuichi Wakaki, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/10 (2006.01); H05K 1/18 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/108 (2013.01); H05K 1/0245 (2013.01); H05K 1/0296 (2013.01); H05K 1/189 (2013.01); H05K 3/18 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/09272 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/0505 (2013.01); H05K 2203/1476 (2013.01);
Abstract

An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length yand length S satisfy 0<y<S, length yextending from the first corner portion reaching the first widthwise other end edge of the first linear portion, and length S extending from the first widthwise other end edge of the first linear portion of one wire, and the predetermined angle θ satisfies 0<θ<1 deg.


Find Patent Forward Citations

Shibata, Shusaku. (2021). Wired circuit board and production method thereof (U.S. Patent No. 11032913). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11032913

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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