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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11032454 B1

PDFFull Text
Expired
Date of Patent:
Jun. 08, 2021

Filed:

Jan. 11, 2018

Circuit board, molded photosensitive assembly and manufacturing method therefor, photographing module, and electronic device

Applicant:

Ningbo Sunny Opotech Co., Ltd., Zhejiang, CN;

Inventors:

Mingzhu Wang, Ningbo, CN;

Zhenyu Chen, Ningbo, CN;

Duanliang Cheng, Ningbo, CN;

Takehiko Tanaka, Nara, JP;

Bojie Zhao, Ningbo, CN;

Nan Guo, Ningbo, CN;

Yafei Wang, Ningbo, CN;

Assignee:

NINGBO SUNNY OPOTECH CO., LTD., Zhejiang, CN;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Mark T Monk

Int. Cl.
CPC ...
H04N 5/225 (2006.01); H01L 27/146 (2006.01); H01L 23/58 (2006.01); H01L 23/552 (2006.01); G02B 7/04 (2021.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2254 (2013.01); H01L 23/552 (2013.01); H01L 27/14618 (2013.01); H01L 27/14636 (2013.01); G02B 7/04 (2013.01); H01L 23/585 (2013.01); H01L 24/48 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01);
Abstract

The present invention provides a circuit board, a molded photosensitive assembly and manufacturing method therefor, a photographing module, and an electronic device. The circuit board comprises a substrate and at least one circuit portion formed on the substrate. A photosensitive element and the circuit portion are conductively connected. The circuit portion forms a ring circuit in an edge region of the substrate. The ring circuit surrounds the photosensitive element, so that in a molding process, the photosensitive element can be protected by the ring circuit.

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Wang, Mingzhu. (2021). Circuit board, molded photosensitive assembly and manufacturing method therefor, photographing module, and electronic device (U.S. Patent No. 11032454). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11032454

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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