The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 2021

Filed:

Mar. 30, 2018
Applicant:

Kyocera Corporation, Kyoto, JP;

Inventors:

Masaki Nambu, Katano, JP;

Hiroyuki Tanaka, Kyoto, JP;

Assignee:

KYOCERA Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 9/10 (2006.01); H03H 9/25 (2006.01); H03H 9/02 (2006.01); H03H 9/145 (2006.01); H03H 9/64 (2006.01); H03H 9/72 (2006.01);
U.S. Cl.
CPC ...
H03H 9/1092 (2013.01); H03H 9/02905 (2013.01); H03H 9/14541 (2013.01); H03H 9/25 (2013.01); H03H 9/6483 (2013.01); H03H 9/725 (2013.01);
Abstract

A surface acoustic wave (SAW) device includes a piezoelectric substrate, an interdigital transducer (IDT) electrode located on an upper surface of the piezoelectric substrate, a cover covering the upper surface of the piezoelectric substrate from above the IDT electrode, at least one first via conductor extending through at least part of the cover from the upper surface of the piezoelectric substrate to an upper surface of the cover, at least one second via conductor located, on the piezoelectric substrate, inward from the first via conductor in a plan view, extending through at least part of the cover from the upper surface of the piezoelectric substrate to the upper surface of the cover, and having a smaller diameter than the first via conductor, and a conductive layer located on the upper surface of the cover and extending over an upper end of the second via conductor.


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