The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 2021

Filed:

Aug. 13, 2019
Applicant:

Furukawa Electric Co., Ltd., Tokyo, JP;

Inventors:

Yuta Ishige, Tokyo, JP;

Maiko Ariga, Tokyo, JP;

Masaki Iwama, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/02251 (2021.01); H01S 5/042 (2006.01); H01S 5/10 (2021.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02251 (2021.01); H01S 5/0428 (2013.01); H01S 5/1078 (2013.01); G02B 6/42 (2013.01);
Abstract

A semiconductor laser module includes a semiconductor laser device that outputs laser light; an optical fiber that includes a core portion and a cladding portion formed at an outer periphery of the core portion and that receives the laser light from one end and guides the laser light to the outside of the semiconductor laser module; an optical part disposed at an outer periphery of the optical fiber, having optical transmittance at a wavelength of the laser light, and that fixes the optical fiber; a first fixative that fixes the optical part and the optical fiber; and a housing that accommodates the semiconductor laser device and the one end of the optical fiber that receives the laser light, wherein an optical reflection reducing region treated to absorb the laser light and having a rough surface is formed around the optical part.


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