The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 2021

Filed:

May. 15, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Effendi Leobandung, Stormville, NY (US);

Carol Boye, Latham, NY (US);

Fee Li Lie, Albany, NY (US);

Shravan Kumar Matham, Guilderland, NY (US);

Brad Austin, Wappingers Falls, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 22/20 (2013.01); H01L 2223/54433 (2013.01);
Abstract

An advanced security method for verifying that integrated circuit patterns being processed into one or more layers provided to a wafer are trusted patterns and that the wafer being used during processing is a trusted wafer is provided. The method includes separate steps of pattern verification and wafer verification. Notably, the method includes first verifying that a pattern printed on a wafer matches a pattern of a trusted reference. Next, a peak and valley profile present at a specific location on a backside surface of the wafer is measured. The method further includes second verify that the measured peak and valley profile matches an original peak and valley profile measured at the same location on the backside surface of the wafer.


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