The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 2021

Filed:

Nov. 26, 2019
Applicants:

Hyundai Motor Company, Seoul, KR;

Kia Motors Corporation, Seoul, KR;

Inventors:

Sung-Won Park, Incheon, KR;

Hyeon-Uk Kim, Hwaseong-si, KR;

Tae-Hwa Kim, Hwaseong-si, KR;

Jun-Hee Park, Hwaseong-si, KR;

Hyun-Koo Lee, Goyang-si, KR;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/373 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3736 (2013.01); H01L 21/4871 (2013.01); H01L 23/3672 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 2224/29147 (2013.01);
Abstract

A spacer structure, which connects an insulating substrate and a semiconductor chip of a double-sided-cooled power module, includes: a conductive material layer which is composed of a composite material; an underlying plating layer disposed on the conductive material layer; and a copper plating layer disposed on the underlying plating layer, in which the copper plating layer is in contact with a joining material that joins the spacer to the semiconductor chip and the insulating substrate.


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