The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 2021

Filed:

Jul. 01, 2019
Applicant:

Huazhong University of Science and Technology, Hubei, CN;

Inventors:

Jiankui Chen, Hubei, CN;

Yiwei Jin, Hubei, CN;

Zhouping Yin, Hubei, CN;

Yongan Huang, Hubei, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/677 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 21/67144 (2013.01); H01L 21/67736 (2013.01); H01L 33/0095 (2013.01);
Abstract

A laser stripping mass-transfer device includes a microdevice laser stripping transfer module, an auxiliary conveyor module, a transition conveyor module, a transfer conveyor module, a substrate carrier module, a microdevice filling module, a curing module, an encapsulation module and a substrate transportation module. The microdevice laser stripping transfer module is configured to implement detection and stripping of the microdevices. The auxiliary conveyor module is configured to adhere the stripped microdevices. The transition conveyor module is configured to pick up and transfer the microdevices to the transfer conveyor module. The transfer conveyor module is configured to pick up and transfer the microdevices to the substrate carrier module. The substrate carrier module is configured to feed the microdevices into the microdevice filling module, the curing module, the encapsulation module, and the substrate transportation module for filling, curing, encapsulating, loading and unloading.


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