The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 2021
Filed:
Jan. 25, 2017
Applicant:
Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;
Inventor:
Kyoichi Suguro, Kanagawa, JP;
Assignee:
TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 16/511 (2006.01); C23C 16/18 (2006.01); C23C 16/30 (2006.01); C23C 16/452 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32229 (2013.01); C23C 16/18 (2013.01); C23C 16/303 (2013.01); C23C 16/452 (2013.01); C23C 16/511 (2013.01); H01J 37/3244 (2013.01); H01J 37/32192 (2013.01); H01J 37/32357 (2013.01); H01J 37/32724 (2013.01); H01J 2237/3321 (2013.01);
Abstract
A semiconductor manufacturing apparatus includes a first supply part configured to supply a gas including one or more group III elements on a substrate accommodated in a reaction chamber, a second supply part configured to supply a gas including one or more group V elements on the substrate, and a waveguide configured to irradiate a microwave to the gas including the one or more group V elements.