The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 2021

Filed:

Dec. 29, 2017
Applicants:

China Petroleum & Chemical Corporation, Beijing, CN;

Sinopec Tech Houston, Llc., Houston, TX (US);

Inventors:

Sheng Zhan, Houston, TX (US);

Jinhai Zhao, Houston, TX (US);

Fengtao Hu, Houston, TX (US);

Herong Zheng, Houston, TX (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G05B 23/02 (2006.01); E21B 44/00 (2006.01); E21B 17/16 (2006.01); G05B 13/04 (2006.01); E21B 7/04 (2006.01); E21B 47/007 (2012.01);
U.S. Cl.
CPC ...
G05B 23/0243 (2013.01); E21B 7/04 (2013.01); E21B 17/16 (2013.01); E21B 44/005 (2013.01); E21B 47/007 (2020.05); G05B 13/04 (2013.01);
Abstract

A method for assessing reliability of an electronic component under downhole vibration conditions include designing a set of vibration test conditions and conduct failure analysis. The vibration test conditions include the natural vibration frequency, the overstress limit of the test vehicle, and the step stress profile for testing the test vehicle. The failure analysis of the failed electronic component includes the step of measuring an electrical resistance of the failed electronic component without a vibration load. When the electrical resistance of the failed electronic component remains large, the failed electronic component is cross-sectioned. Finally, the cross-sectioned electronic component is examined to identify a failure mode.


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