The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 2021

Filed:

Apr. 20, 2018
Applicant:

Disney Enterprises, Inc., Burbank, CA (US);

Inventors:

Moritz Bächer, Zürich, CH;

Stelian Coros, Zürich, CH;

Lars Espen Knoop, Zürich, CH;

Hongyi Xu, Zürich, CH;

Assignee:

Disney Enterprises, Inc., Burbank, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/4097 (2006.01); G06F 30/00 (2020.01); G06F 113/16 (2020.01); G06F 119/18 (2020.01);
U.S. Cl.
CPC ...
G05B 19/4097 (2013.01); G06F 30/00 (2020.01); G05B 2219/35134 (2013.01); G05B 2219/36203 (2013.01); G06F 2113/16 (2020.01); G06F 2119/18 (2020.01);
Abstract

Methods and corresponding systems that are useful in design and fabrication of kinetic wire mechanisms or characters. The method includes a computational technique for the design of kinetic wire mechanisms tailored for fabrication on consumer-grade hardware such as a desktop CNC bending device. The method takes as input a skeletal animation of the mechanism to be fabricated and estimates, from the skeletal animation, a cable-driven and compliant wire structure, which matches user-selected keyframes. To enable localized deformations, the technique involves shaping the mechanism's body (i.e., the wire) into functional spring-like entities at a set of locations along the length of the mechanism's body. The method involves determining where on the wire body to place these spring-like entities, determining which types or configurations of spring-like entities should be placed at each of these locations, and optimizing parameters of each user-selected spring-like entity for use at the locations on the wire mechanism.


Find Patent Forward Citations

Loading…