The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11029598 B1

Date of Patent:

Jun. 08, 2021

Filed:

Aug. 31, 2018

Photosensitive polyimide composition and photoresist film made thereof

Applicant:

Echem Solutions Corp., Taoyuan, TW;

Inventors:

Tz Jin Yang, Taoyuan, TW;

Ming Che Chung, Taoyuan, TW;

Assignee:

eChem Solutions Corp., Taoyuan, TW;

Attorney:

Primary Examiner:

Chanceity N Robinson

Int. Cl.

CPC ...

G03F 7/20 (2006.01); G03F 7/023 (2006.01); G03F 7/039 (2006.01); G03F 7/004 (2006.01); C08G 73/10 (2006.01); G03F 7/38 (2006.01); G03F 7/26 (2006.01); G03F 7/16 (2006.01); G03F 7/075 (2006.01); G03F 7/022 (2006.01);

U.S. Cl.

CPC ...

G03F 7/0233 (2013.01); C08G 73/1046 (2013.01); G03F 7/0045 (2013.01); G03F 7/0226 (2013.01); G03F 7/039 (2013.01); G03F 7/0757 (2013.01); G03F 7/16 (2013.01); G03F 7/168 (2013.01); G03F 7/20 (2013.01); G03F 7/26 (2013.01); G03F 7/38 (2013.01);

Abstract

The present invention provides a photosensitive polyimide composition comprising a polyimide resin having a structural unit represented by the formula (1) and a structural unit represented by the formula (2), a quinonediazide sulfonate, a thermal curing agent, and a thermal acid generator. In the formulas (1) and (2), n is an integer of 10 to 600, Aris a tetravalent organic group; Aris a divalent to tetravalent organic group; Aris a divalent aromatic group; and Ris an OH group or a COOH group. The present invention also provides a photoresist film made of the above-mentioned photosensitive polyimide composition.

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