The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 2021
Filed:
Apr. 30, 2019
Hongfujin Precision Electronics (Chengdu) Co., Ltd., Chengdu, CN;
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Zi-Qing Xia, Chengdu, CN;
Xiao-Lei Liu, Chengdu, CN;
Min Chen, Chengdu, CN;
Yi-Kun Wang, Chengdu, CN;
Fu-Ju Zeng, Chengdu, CN;
HONGFUJIN PRECISION ELECTRONICS (CHENGDU) Co., Ltd., Chengdu, CN;
HON HAI PRECISION INDUSTRY CO., LTD., New Taipei, TW;
Abstract
A solder paste printing quality inspection (SPI) method includes establishing at least one data inspection model, acquiring real-time test data, preprocessing the real-time test data, and determining a type of the real-time test data and inputting the real-time test data into the data inspection model corresponding to the type of the real-time test data to obtain a judgment result of the solder paste printing quality inspection. The real-time test data includes one or both of a test image and a test value of solder paste printing quality inspection. The preprocessing includes obtaining key parameters of the test value or obtaining image data of the test image and standardizing the real-time test data.