The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 2021

Filed:

Oct. 17, 2019
Applicant:

Cyberoptics Coporation, Golden Valley, MN (US);

Inventors:

Paul R. Haugen, Bloomington, MN (US);

Carl E. Haugen, St. Paul, MN (US);

Eric P. Rudd, Hopkins, MN (US);

Timothy A. Skunes, Mahtomedi, MN (US);

Assignee:

CyberOptics Corporation, Golden Valley, MN (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01B 11/25 (2006.01); G01B 11/30 (2006.01); H04N 5/372 (2011.01);
U.S. Cl.
CPC ...
G01B 11/2527 (2013.01); G01B 11/25 (2013.01); G01B 11/30 (2013.01); H04N 5/372 (2013.01);
Abstract

An optical phase profilometry system includes a first operative coaxial camera-projector pair aligned at a first angle relative to a target surface that projects a first illumination on the target surface and a second operative coaxial camera-projector pair aligned at a second angle relative to the target surface that projects a second illumination on the target surface. Wherein the first and second angles are equal and opposite to one another relative to the target surface such that the second operative coaxial camera-projector pair is configured to capture a first reflection from the first illumination and the first operative coaxial camera-projector pair is configured to capture a second reflection from the second illumination. The optical phase profilometry system further includes a controller configured to, based on the captured first and second reflections, generate a first and second estimation of the target surface and combine them to generate a dimensional profile of the target surface.


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