The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 2021
Filed:
Feb. 26, 2018
Nanjing University of Science and Technology, Jiangsu, CN;
Qian Chen, Nanjing, CN;
Chao Zuo, Nanjing, CN;
Shijie Feng, Nanjing, CN;
Jiasong Sun, Nanjing, CN;
Yuzhen Zhang, Nanjing, CN;
Guohua Gu, Nanjing, CN;
NANJING UNIVERSITY OF SCIENCE AND TECHNOLOGY, Nanjing, CN;
Abstract
A super-rapid three-dimensional measurement method and system based on an improved Fourier transform contour technique is disclosed. The method comprises: firstly calibrating a measurement system to obtain calibration parameters, then cyclically projecting 2n patterns into a measured scene using a projector, wherein n patterns are binary sinusoidal fringes with different high frequency, and the other n patterns are all-white images with the values of 1, and projecting the all-white images between every two binary high-frequency sinusoidal fringes, and synchronously acquiring images using a camera; and then performing phase unwrapping on wrapped phases to obtain initial absolute phases, and correcting the initial absolute phases, and finally reconstructing a three-dimensional topography of the measured scene by exploiting the corrected absolute phases and the calibration parameters to obtain 3D spatial coordinates of the measured scene in a world coordinate system, thereby accomplishing three-dimensional topography measurement of an object. In this way, the precision of three-dimensional topography measurement is ensured, and the speed of three-dimensional topography measurement is improved.