The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 2021

Filed:

Apr. 28, 2019
Applicant:

Hangzhou Binary Optoelectronics & Tech. Co., Ltd., Hangzhou, CN;

Inventors:

Gaole Zhang, Hangzhou, CN;

Kang Zhou, Hangzhou, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21K 9/235 (2016.01); F21K 9/232 (2016.01); F21V 9/30 (2018.01); F21K 9/90 (2016.01); F21V 19/00 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); F21Y 115/10 (2016.01); F21Y 107/50 (2016.01);
U.S. Cl.
CPC ...
F21K 9/235 (2016.08); F21K 9/232 (2016.08); F21K 9/90 (2013.01); F21V 9/30 (2018.02); F21V 19/005 (2013.01); H05K 1/0366 (2013.01); H05K 1/117 (2013.01); H05K 1/14 (2013.01); H05K 1/181 (2013.01); F21Y 2107/50 (2016.08); F21Y 2115/10 (2016.08); H05K 2201/0108 (2013.01); H05K 2201/09027 (2013.01); H05K 2201/09163 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10318 (2013.01);
Abstract

An LED filament and lamp, and a manufacturing process of an LED filament, the LED filament includes a PCB substrate and multiple LED chips, connecting circuits are provided on the PCB substrate, a positive pin and a negative pin are provided at two ends of the connecting circuit, respectively, and each LED chip is electrically connected to the connecting circuit; and a fluorescent glue layer is provided outside the PCB substrate and the LED chips, and the positive pin and the negative pin are exposed from the fluorescent glue layer. The LED lamp includes the LED filament. The manufacturing process of an LED filament enables manufacturing an LED filament. For the LED filament and lamp, and the manufacturing process of an LED filament, a PCB substrate is used as a base material, connecting circuits are fabricated on the PCB substrate, the connecting circuits are directly used for connecting LED chips.


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