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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11028495 B1

PDFFull Text
Date of Patent:
Jun. 08, 2021

Filed:

Mar. 18, 2018

Method for producing porous copper foil and porous copper foil produced by the same

Applicant:

Ymt Co., Ltd., Icheon, KR;

Inventors:

Sung Wook Chun, Incheon, KR;

Ik Beom Kim, Incheon, KR;

Seon Gi Jeon, Ansan-si, KR;

Dae Hoon Lee, Anyang-si, KR;

Youn Bong Kang, Incheon, KR;

Jun Mo Hong, Ansan-si, KR;

Hyeong Gyu Park, Ansan-si, KR;

Assignee:

YMT CO., LTD., Incheon, KR;

Attorney:

STIP Law Group, LLC

Primary Examiner:

Louis J Rufo

Int. Cl.
CPC ...
C25D 1/08 (2006.01); C23C 18/16 (2006.01); C25D 3/38 (2006.01); C23C 18/38 (2006.01); C23F 17/00 (2006.01); C25D 1/04 (2006.01); C25D 1/20 (2006.01); C23C 18/54 (2006.01);
U.S. Cl.
CPC ...
C25D 1/08 (2013.01); C23C 18/1646 (2013.01); C23C 18/1651 (2013.01); C23C 18/1653 (2013.01); C23C 18/1657 (2013.01); C23C 18/38 (2013.01); C23C 18/54 (2013.01); C23F 17/00 (2013.01); C25D 1/04 (2013.01); C25D 1/20 (2013.01); C25D 3/38 (2013.01);
Abstract

Provided is a method for producing a porous copper foil. The method includes forming a release layer on a metal carrier, growing copper islands on the metal carrier formed with the release layer by electroless copper plating, forming a porous copper thin layer by copper electroplating, and peeling off the porous copper thin layer from the release layer.

Find Patent Forward Citations

Chun, Sung. (2021). Method for producing porous copper foil and porous copper foil produced by the same (U.S. Patent No. 11028495). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11028495

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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