The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 2021

Filed:

Jan. 11, 2018
Applicant:

Shpp Global Technologies B.v., Bergen op Zoom, NL;

Inventors:

Yaqin Zhang, Shanghai, CN;

Jian Wang, Shanghai, CN;

Mingcheng Guo, Shanghai, CN;

Yunan Cheng, Shanghai, CN;

Shijie Song, Shanghai, CN;

Assignee:

SHPP Global Technologies B.V., Bergen op Zoom, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/04 (2006.01); C08K 3/22 (2006.01); C08K 3/34 (2006.01); C08K 3/38 (2006.01); C08K 7/14 (2006.01); C23C 18/16 (2006.01); C08L 23/06 (2006.01); C08L 27/18 (2006.01); C08L 69/00 (2006.01);
U.S. Cl.
CPC ...
C08K 3/04 (2013.01); C08K 3/2279 (2013.01); C08K 3/346 (2013.01); C08K 3/38 (2013.01); C08K 7/14 (2013.01); C23C 18/1641 (2013.01); C08K 2003/2241 (2013.01); C08K 2003/385 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01); C08L 23/06 (2013.01); C08L 27/18 (2013.01); C08L 69/005 (2013.01); C08L 2203/20 (2013.01);
Abstract

The disclosure concerns thermally conductive polymer compositions comprising: (a) from about 20 wt % to about 80 wt % of at least one polymer component; (b) from greater than about 0 wt % to about 70 wt % of a thermally conductive filler; and (c) from about 0.1 wt % to about 40 wt % of a laser activatable additive having a core-shell structure; wherein the core comprises an inorganic filler and the shell comprises a laser activatable component; wherein the combined weight percent value of all components does not exceed about 100 wt %; wherein all weight percent values are based on the total weight of the composition; and wherein a molded sample of the blended thermoplastic composition has a through plane thermal conductivity of at least about 0.40 W/m·K when determined in accordance with ASTM E1461.


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