The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 2021

Filed:

Nov. 24, 2016
Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Tomohiro Shimono, Sakura, JP;

Junji Yamaguchi, Sakura, JP;

Masato Otsu, Sakura, JP;

Kazuo Arita, Sakura, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C07D 265/16 (2006.01); C08G 61/12 (2006.01); C08J 5/24 (2006.01); H01L 23/29 (2006.01); H05K 1/03 (2006.01); H01L 23/31 (2006.01); B32B 15/08 (2006.01); C08K 3/013 (2018.01); B32B 5/02 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); B32B 27/42 (2006.01); H01L 23/14 (2006.01); H01L 23/373 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
C07D 265/16 (2013.01); B32B 5/02 (2013.01); B32B 15/08 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); B32B 27/42 (2013.01); C08G 61/122 (2013.01); C08J 5/24 (2013.01); C08K 3/013 (2018.01); H01L 23/145 (2013.01); H01L 23/29 (2013.01); H01L 23/31 (2013.01); H01L 23/3737 (2013.01); H05K 1/0204 (2013.01); H05K 1/03 (2013.01); H05K 1/0373 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2457/08 (2013.01); C08G 2261/12 (2013.01); C08G 2261/3245 (2013.01); C08J 2365/00 (2013.01); H01L 23/295 (2013.01);
Abstract

The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.


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